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BIWIN Black Opal X570 2TB PCIe Gen5×4 NVMe 2.0 M.2 2280 SSD Up to 14500/11000 MB/s High-Speed 3D TLC NAND Storage
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SKU: bx570nn02tb-rgx

Availability: In Stock

Brand: BIWIN

Category: Solid State Drives (SSD)

$599.00


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Description
SPECIFICATION
Review

The BIWIN Black Opal X570 is a cutting-edge PCIe Gen5×4 NVMe 2.0 solid-state drive designed for professionals and gamers seeking ultra-fast storage solutions. Featuring a sleek M.2 2280 single-sided form factor, it delivers sequential read speeds up to 14,500 MB/s and write speeds up to 11,000 MB/s (depending on the model and capacity). Built with premium 3D TLC NAND flash memory and a DRAM-less architecture enhanced by Host Memory Buffer (HMB) and intelligent SLC caching, it achieves superior responsiveness and sustained performance for demanding workflows including gaming, video editing, and intensive compute tasks.

This SSD utilizes advanced thermal management technology, incorporating a thermal graphene pad and a temperature-control algorithm to maintain optimal operating temperatures. For best performance stability during heavy load, additional cooling solutions are recommended. The drive supports PCIe 5.0 and remains backward compatible with PCIe 4.0 and 3.0 interfaces.

With an MTBF of 1,500,000 hours, and certifications spanning RoHS, FCC, CE, CB, KCC, BSMI, VCCI, RCM, and UKCA, the Black Opal X570 assures high reliability. It carries a 5-year limited warranty with endurance ratings (TBW) that scale by capacity, making it a dependable choice for high-throughput storage needs.

For optimal compatibility, BIWIN recommends pairing the Black Opal X570 with AMD Ryzen 9000 series processors and X870 chipsets. Explore enhanced performance possibilities with this premium Gen5 SSD.

Physical

Weight\u2264 9 g
Cable Type1,500,000 hours
Connector FeatureRoHS,FCC,CE,CB,KCC,BSMI,VCCI,RCM,UKCA
Connector Type5-year limited warranty
Heat SpreaderThermal graphene pad
Form FactorThermal graphene pad, temperature control algorithm, DRAM-less with Host Memory Buffer (HMB)
PinsBX570NN02TB-RGX

Connectivity

Networking InterfacesUp to 2,000,000 IOPS
WAN/LAN PortsDRAM-less with Host Memory Buffer (HMB)
Ethernet Ports1

Identification

Part NumberUp to 1,500,000 IOPS
Model1 TB,2 TB,4 TB

Classification

CategoryThermal graphene pad & temperature control algorithm

Technical

WiFi Speed (Mbps)PCIe Gen5×4,NVMe 2.0
BandsM.2 2280 Single-Sided
Voltage (V)5
Module Configuration3D TLC NAND
Total Capacity (GB)PCIe Gen5×4,NVMe 2.0
memory_typeM.2 2280 Single-Sided

Networking

Mesh Technology3D TLC NAND
BackhaulUp to 14,500 MB/s

Performance

Supported Data Rate80.00 x 22.00 x 2.45 mm
Tested Latency9
SPD TimingsMTBF
CAS Latency (CL)1500000
Tested Speed (MHz)11000
Speed (MHz)14500

Management

Management InterfaceUp to 11,000 MB/s

Identifiers

Product Type1500000
Model Number2000000

Identity

Series2.0

General

capacity_gb2000

0.0

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